Prof.Huang XingyiHteDr. Shi Kunmingkaw nnaShanghai Jiao Tong Dakkasu1000 hpe .multilayer gaw n-gun n-gun hte wan n-gun n-gun n-rawng ai tape (MTCEIT). Ndai hpaji ningnan gaw CPU nbung katsi ai lam hpe shayawm ya lu ai.9 degree, n-gun n rawng ai electronic jak ni hta katsi ai hpe garan ginhka lu na matu hparan ladat nnan hpe jaw ya ai.
MTCEIT hkrang masa sandwiches nigraphe laika(1000 lapran na .BNNS{0}} hpe PBCOEA a n-gun jaw ai lam ni, hte rau hpawng de ai.silicone rubber (SR) hpe madi shadaw ai lamhpring aihexagonal boron nitride (h-BN)flakes. N-gun n-gun daram hta .300 μm, dai tape gaw .121.22 W/m·K ., a 5.07×1011111111119 gaw n-gun n-gun n-gun n-gun n-gun n-gun,Weibull a arawn alai hkrat sum ai n-gun 36.9 kV/mm.
Tengman ai- mungkan chyam dinglik ai lam ni hta, MECEIT gaw .CPU n-gun n law ai laptop ni a katsi ai lam hpe 9℃jat aihte shim lum aivideo frame rate galai shai ai lam gaw 0.1 fps hta grau ai (sh) maren sha re.ultra-thin smartphone ni hpe active cooling n galaw ai sha.
Ndai sawk sagawn ai lam hpe ."Graphene Paper-Based Multilayer Thermally Conductive Tapes with Exceptional Electrical Insulation for High Heat Flux Dissipation,"hpe 2010 hta shapraw aiHpaji jaw ai bungli galaw ai arung arai ni (AFM).
Hkrang 1. MTCEIT a hkrang shapraw ai lam.
(a) MTCEIT hpe lawm ai n-gun n rawng ai electronic jak ni hta katsi ai hpe garan kachyan ai ladat hpe hkrang shala ai.
(b) Hpang jahtum na element shingdaw ai lam ni hta, n bung ai npawt nhpang ni a npu e, n bung ai npawt nhpang ni hte n bung ai hkrang masa ni hpe garan ginhka ai lam.
(c–e) N-gun n rawng ai daw hpe shingdaw ai lam ni hta, n-gun rawng ai n-gun hpe (c) layer langai hte langai a n-gun shadawn shadang, (d) in{0}}plane (κ//) hte n-gun rawng ai n-gun (κ⊥) hku nna, n-gun rawng ai layer ni a thermal conductivity hku nna, (e) adhesive layer hte adhesive layer lapran na interfacial thermal resistance hpe lai nna, n-gun rawng ai n-gun hpe n-gun jaw ai. ultrahigh-κ/ layer hpe mung, n-gun rawng ai layer hte backing layer lapran mung .
Hkrang 2. MTCEIT a hkrang hte jak rung atsam ni.
(a) MTCEIT hte hpaga lam hte seng ai graphene laika buk ni a kaja ai sumla ni.
(b) Cross{0}} daw hte (c) MTCEIT a SEM sumla ni hpe matut mahkai ai SEM sumla ni.
(d) EDS spectrum hte (e) MTCEIT a XRD hkrang.
(f) MTCEIT a bending hte (g) hkrang shapraw ai masa ni.
(h) MTCEIT a n-gun n-gun hte n-gun n-gun n-rawng ai curve.
Hkrang 3. MTCEITs ni a n-gun n-gun hte wan n-gun hpe n-gun n-rawng ai.
Hkrang 4. Laptop hpe katsi shangun ai.
(a) Laptop motherboard a kaja dik ai sumla. MTCEIT a galu kaba ai lam gaw 130 mm × 60 mm re.
(b) asan sha galaw da ai CPU katsi ai hpe shapraw kau ai ladat a hkrang sumla.
(c) Laptop a thermal sumla ni hpe infrared thermal sumla ni.
(d) N-gun n bung ai lam hte (e) CPU nbung katsi ai 1200 s. Inset (d) hta chyam yu ai laptop a optical sumla hpe madun da ai.
Chyam dinglik ai lam yawng hpe shingra tara hku galaw ai masa hta galaw ai. Dai nbung laru hpe gawgap da ai{{1}in CPU sensor hte shadawn nna AIDA644 Extreme software hpe lang nna yu reng ai.
Hkrang 5. ultra-}thin smartphone hpe n-gun n rawng ai sha n-gun dat dat ai.
